Latent accelerator for hot curing of epoxy resin systems used in the composite, powder coating and adhesive industry.
| Product Name | Particle Size | Description | Application Areas |
| Ecure 20 | 98%≤15 μm | Organic Urea Latency AcceleratorEconomic | Adhesive Prepreg |
| Dyhard UR200 | 98%≤10 μm | Organic Urea Latency Accelerator | Adhesive Prepreg |
| Ecure 30 | 98%≤15 μm | Organic Urea Latency Accelerator,Economic No Halogen Curing Speed: Moderate | Adhesive Prepreg |
| Dyhard UR300 | 98%≤10 μm | Organic Urea Latency Accelerator,No halogen Curing Speed: moderate | Adhesive Prepreg |
| Dyhard UR500 | 98%≤10 μm | Organic Urea Latency AcceleratorNo Halogen Non-poisonous Water-solubility, Curing Speed: Fast | Adhesive PrepregWater-base paint |
| Dyhard MI-C | Dimethylimidazole | CCL Powder Coating |
